Products · LCP
Liquid Crystal Polymer (LCP) is a unique polymer family that exhibits a mesophase — an ordered liquid-crystalline state — in the melt. The rigid-rod molecular structure aligns under flow, giving LCP exceptional properties: very high melt flow (allowing ultra-thin-wall injection molding at 0.1-0.2 mm wall thickness), very low dielectric loss at high frequencies (Df < 0.005 at 10 GHz), high HDT (240-280°C), and inherent flame retardance. LCP is the material of choice for ultra-thin-wall SMT connectors, 5G mmWave antenna substrates, AI server high-speed sockets, and optical transceiver components. The trend toward miniaturization and higher frequencies in 5G, AI, and data center electronics is driving strong LCP demand growth. Reference grades from Celanese (Vectra), DuPont (Zenite), and Sumitomo Chemical (Sumikasuper) cover the full property range.
Section 1
A reference overview of the molecular architecture and the design variables that govern the performance of this polymer family.
LCP is a copolymer of aromatic monomers (typically hydroxybenzoic acid, naphthalene dicarboxylic acid, and biphenol) that produce a rigid-rod molecular structure. The rigid-rod structure causes the polymer chains to align in the melt under flow, creating a mesophase (liquid-crystalline state) that gives LCP its unique combination of high flow, low viscosity, and self-reinforcement. The alignment is preserved in the solid part, giving anisotropic properties — much higher strength and modulus in the flow direction than the transverse direction. The aromatic backbone gives LCP its high HDT, inherent flame retardance, and chemical resistance.
Section 2
Typical property ranges across commercial grades. Test methods are listed in the rightmost column for traceability to public manufacturer data sheets.
LCP's defining properties are extreme melt flow (allowing 0.1 mm wall thickness molding), very low dielectric loss at high frequency (Df < 0.005 at 10 GHz), high HDT (240-280°C), and inherent flame retardance. The high flow is enabled by the rigid-rod molecular structure aligning under flow, dramatically reducing melt viscosity.
| Property · 性能 | Vectra A130 (30% GF) | Vectra E130i (30% GF) | Test Method · 测试方法 |
|---|---|---|---|
| Density · 密度 | 1.60 – 1.65 g/cm³ | 1.60 – 1.65 g/cm³ | ASTM D792 |
| Melt Viscosity · 熔体粘度 | Very low (high flow) | Very low (high flow) | Capillary rheometer |
| Tensile Strength · 拉伸强度 | 150 – 200 MPa | 140 – 180 MPa | ASTM D638 |
| HDT (1.82 MPa) · 热变形 | 240 – 270 °C | 230 – 260 °C | ASTM D648 |
| Dk (1 GHz) · 介电常数 | 2.8 – 3.2 | 2.6 – 3.0 | ASTM D2520 |
| Df (10 GHz) · 介电损耗 | 0.004 – 0.006 | 0.003 – 0.005 | ASTM D2520 |
| Flammability · 阻燃 | V-0 inherent | V-0 inherent | UL94 |
| Mold Shrinkage · 成型收缩 | 0.1 – 0.3 % (very low) | 0.1 – 0.3 % (very low) | ASTM D955 |
Section 3
The major application areas for this polymer family, each illustrated with a brief description of how the material is specified and used.
LCP is the dominant material for ultra-thin-wall SMT connectors (0.1-0.2 mm wall thickness) in smartphones, wearables, and 5G mobile devices. The extreme melt flow allows filling of micro-cavities; the high HDT allows reflow soldering at 260-280°C peak; the low Df ensures signal integrity at high data rates.
LCP is increasingly used as the substrate material for 5G mmWave antenna modules operating at 24-60 GHz. The low Df at high frequency (Df < 0.005 at 10 GHz, sustained up to 100 GHz) preserves signal integrity; the low Dk (2.6-3.0) enables smaller antenna geometries; the high HDT survives SMT reflow; and the low moisture absorption maintains stable dielectric properties in humid environments.
LCP is used in high-speed sockets and interconnects for AI servers, GPUs, and high-performance computing where signal integrity at multi-GHz data rates is critical. The low Df, low moisture absorption, and dimensional stability are key advantages over PPA and PPS in these applications.
LCP is used in optical transceiver housings, optical engine components, and laser diode submounts where the combination of low Df, dimensional stability, and high heat resistance is required. The trend toward 800G and 1.6T optical transceivers is driving LCP demand in data center optics.
Section 4
Key processing parameters and equipment considerations. Contact our business manager for grade-specific processing recommendations.
| Melt Temperature | 280 – 340 °C; mold temperature 70 – 120 °C (low mold temp acceptable) |
| Drying | 150 °C for 4 – 6 hours (moisture < 0.02%) |
LCP melt viscosity is very shear-sensitive — viscosity drops dramatically with increasing shear rate. The flow is also highly anisotropic: parts with flow-direction-dependent properties (weld lines are weak) require careful gate location design. Mold temperature can be lower than other engineering polymers (70-120°C vs 140-160°C for PPA) — this is a processing advantage for thin-wall parts. LCP generates little flash at molding, allowing high-precision small parts.
Section 5
A summary of when this polymer family is the right choice and what to consider as alternatives. For project-specific grade selection, contact our business manager.
Choose LCP for ultra-thin-wall injection molding (0.1-0.2 mm), high-frequency electronics (5G mmWave, AI server, optical transceiver), and SMT reflow capable connectors. For high-frequency applications below 6 GHz, PPA may suffice at lower cost. For SMT connectors without thin-wall requirements, PPA or PA9T may be more cost-effective. For very high temperatures (Tg > 280°C) or extreme chemical resistance, PEEK is preferred.
Section 6
Reference grades from publicly available manufacturer catalogs. Complete catalog available on request.
| Grade | Manufacturer | Key Properties | Typical Use |
|---|---|---|---|
| Vectra® A130No vendor TDS · source on request | Celanese (Ticona legacy) | 30% GF · High flow · Standard | SMT connector · Ultra-thin-wall parts |
| Vectra® E130iNo vendor TDS · source on request | Celanese | 30% GF · Low Df · High frequency | 5G mmWave · Optical transceiver · AI server |
| Zenite® 6330 | DuPont | 30% GF · High flow · Standard | Ultra-thin-wall SMT · Miniaturized parts |
| Sumikasuper® E5008Internal snapshot · original TDS on request | Sumitomo Chemical | 30% GF · High flow · High heat | SMT connector · Lead-free reflow |
| Sumikasuper® E6006Internal snapshot · original TDS on request | Sumitomo Chemical | 30% GF · Low Df · High frequency | mmWave substrate · Optical module |
Section 7
Cross-references to industry-specific applications and case studies.